In this paper, out-of-plane random vibration reliability of a ceramic column grid array (CCGA) package was tested in accordance with the ECSS-Q-70-08C standard. Microstructure observations revealed that there was no failure at the solder joints between Sn–Pb columns and the bond pads. However, random vibration life prediction based on traditional Miner’s rule showed that there would be failure in the critical corner solder joint. To properly evaluate the random vibration life of CCGA, an improved Miner’s rule was proposed, accounting for the cumulative damage. Based upon the improved Miner’s rule, the CCGA package could pass the random vibration test, which agreed well with the experimental results. Therefore, the improved Miner’s rule is much better suitable for practical CCGA random vibration life prediction than traditional Miner’s rule.