物理气相沉积优缺点，化学气相沉积和物理气相沉积～～...「专家回答」

化学 气相沉积是一种制备材料的气相生长方法，它是把一种或几种含有构成薄膜元素的化合物、单质气体通入放置有基材的反应室，借助空间气相化学反应在基体表面上沉积固态薄膜的工艺技术。

物理气相沉积技术表示在真空条件下，采用物理方法，将材料源，即固体或液体，表面气化成气态原子、分子或部分电离成离子，并通过低压气体过程，在基体表面沉积具有某种特殊功能的薄膜的技术。

【英文介绍/For English】：

Chemical vapor deposition is a gas phase growth method for preparing materials. It is to pass one or several compounds containing thin film elements and elemental gas into the reaction chamber where the substrate is placed, and deposit on the surface of the substrate by means of space gas phase chemical reaction. Process technology for solid-state thin films.

Physical vapor deposition technology means that under vacuum conditions, using physical methods, the material source, that is, solid or liquid, is vaporized into gaseous atoms, molecules or parts of the ionization into ions, and through the low-pressure gas process, deposits on the surface of the substrate. Functional Thin Film Technology.