工程英文确认常用词及常用语句汇总
单词
1.附件：attached
2.样品：sample
3.承认：approval
4.答复：answer;reply
5.规格：spec
6.与...同样的：the same as
7.前版本：previous version(old version)
8.生产：production
9.确认：confirm
10.再次确认：double confirm
11.工程问题：engineering query（EQ）
12.尽快：ASAP(as soon as possible)
13.生产文件：production gerber
14.联系某人：contact somebody
15.提交样板：submit sample
16.交货期：delivery date
17.电测成本：ET（electrical test）cost
18.通断测试：Open and short testing
19.参考：refer to
20.IPC标准：IPC standard
21.IPC二级：IPC class 2
22.可接受的：acceptable
23.允许：permit
24.制造：manufacture
25.修改：revision
26.公差：tolerance
27.忽略：ignore(omit)
28.工具孔：tooling hole
29.安装孔：mounting hole
30.元件孔：component hole
31.槽孔：slot
32.邮票孔：snap off hole
33.导通孔：via
34.盲孔：blind via
35.埋孔：buried via
36.金属化孔：PTH(plating through hole)
37.非金属化孔：NPTH( no plating through hole)
38.孔位：hole location
39.避免：avoid
40.原设计：original design
41.修改：modify
42.按原设计：leave it as it is
43.附边：waste tab
44.铜条：copper strip
45.拼板强度：panel strong
46.板厚：board thickness
47.删除：remove(delete)
48.削铜：shave the copper
49.露铜：copper exposure
50.光标点：fiducial mark
51.不同：be different from(differ from)
52.内弧：inside radius
53.焊环：annular ring
54.单板尺寸：single size
55.拼板尺寸：panel size
56.铣：routing
57.铣刀：router
58.V-cut：scoring
59.哑光：matt
60.光亮的：glossy
61.锡珠：solder ball(solder plugs)
62.阻焊：solder mask(solder resist)
63.阻焊开窗：solder mask opening
64.单面开窗：single side mask opening
65.补油：touch up solder mask
66.补线：track welds
67.毛刺：burrs
68.去毛刺：deburr
69.镀层厚度：plating thickness
70.清洁度：cleanliness
71.离子污染：ionic contamination
72.阻燃性：flammability retardant
73.黑化：black oxidation
74.棕化：brown oxidation
75.红化：red oxidation
76.可焊性：solderability
77.焊料：solder
78.包装：packaging
79.角标：corner mark
80.特性阻抗：characteristic impedance
81.正像：positive
82.负片：negative
83.镜像：mirror
84.线宽：conductor width
85.线距：conductor spacing
86.做样：build sample
87.按照：as per
88.成品：finished
89.做变更：make the change
90.相类似：similar to
91.规格：specification
92.下移：shift down
93.垂直地：vertically
94.水平的：horizontally
95.增大：increase
96.缩小：decrease
97.表面处理：Surface Finishing
98.波峰焊：wave solder
99.钻孔数据：drilling date
100.标记：Logo
101.Ul 标记：Ul Marking
102.蚀刻标记：etched marking
103.周期：date code
104.翘曲：bow and twist
105.外层：outer layer
106.内层：internal layer
107.顶层：top layer
108.底层：bottom layer
109.元件面：component side
110.焊接面：solder side
111.阻焊层：solder mask layer
112.丝印层：legend layer (silkscreen layer or over layer) 113.兰胶层：peelable SM layer
114.贴片层：paste mask layer
115.碳油层：carbon layer
116.外形层：outline layer(profile layer)
117.白油：white ink
118.绿油：green ink
119.喷锡：hot air leveling (HAL)
120.水金：flash gold
121.插头镀金：plated gold edge-board contacts
122.金手指：Gold-finger
123.防氧化：Entek(OSP)
124.沉金：Immersion gold (chem. Gold)
125.沉锡：Immersion Tin(chem.Tin)
126.沉银：Immersion Silver (chem. silver)
127.单面板：single sided board
128.双面板：double sided board
129.多层板：multilayer board
130.刚性板：rigid board
131.挠性板：flexible board
132.刚挠板：flex-rigid board
133.铣：CNC (mill , routing)
